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electroless nickel and composition. The reduced minimum and newly introduced specifications challenge not only measurement systems but also process control to comply with statistical restrictions on conforming ENIG product. The PCB Fabricator will also have new responsibility to
The minimum specification called for by the IPC for ENIG is 1.6 microinches. This means that a defect free process will be operated with a targeted mean plating of 1.6 microinches plus four standard deviations to ensure that all parts coming out of the process are within
For the recommended deposit the possibility of silver embrittlement is negligible, especially when the assembly solder alloy is a Sn/Pb composition. Excessive of silver combined with lead free silver bearing solder, have the potential to create an embrittled solder joint
We are facing solderability issues on a particular lot of electroless nickel - immersion gold plated circuit boards. The nickel thickness measured with an XRF is around 400 Spec calls out for 130 nickel and 3 - 5 gold.Assuming there is no porosity on the gold
Thus, the reaction on nickel proceeds at a much faster rate than on palladium. The reaction on palladium proceeds at a lower rate and can only achieve a limited . thicknesses on palladium are on the order of 1.2 - 2.0 μ-in. 0.03 - 0.05 μm. Experimental considerations
Plating is a process that applies a very thin layer of by displacement of the surface atoms. This means the coating is not very thick, typically between three and eight micro inches.It offers some corrosion resistance and is used to extend the shelf life of parts waiting for soldering operations
IPC-4556-AM1 is the amendment 1 to the standard IPC-4556 and made the following changes to the base specification: a It added the absolute value of the for the of 0.070 μm [2.8 μin] that accompanies the statistically valid minimum b It added two more photomicrograph images to provide better information on identifying nickel hyper
· After measuring the of the EDGE Card PCB fingers, it was noticed that the plated traces are at their allowable PCB , but adjoining LPI solder masked areas may vary up to 0.012" greater than the adjoining plated contact trace
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ENEPIG – Electroless Nickel Electroless Palladium Typical = Nickel 3 – 6 µm / Palladium is 0.05 – 0.3 µm / 0.05 – 0.125 µm Shelf life = 12 months Excellent for wire bonding
Silver also called Ag is a RoHS compliant lead-free surface finish that is an ideal choice for flat surface requirements and fine pitch components with reasonable costs. This surface finish can also replace over Electroless Nickel Au/Ni for most applications. And the ranges from 0.12 to 0.40 μm
ISIG is a new multifunctional final finish. It shows excellent and aluminum wire bondability as well as excellent solderability for any kind of solder application. It is possible to plate a up to 0.3 µm
3.5.3 Exceptions to the Required Ranges ..... 23 3.5.3.1 Thicker Than Specification
Electroless Nickel ENIG ENIG is the most popular option and is used on about 80% of all PWBs. This finish provides a thin, , solderable layer that protects the copper traces with a nickel barrier between it and the copper. ENIG is a good lead-free option that results in a durable, long-lasting finish. Advantages: